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Team:EPF-Lausanne/Protocols/PDMS two layer device fabrication
From 2011.igem.org
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| - | 1 Place molds into a TMCS vapor chamber | + | <p> 1 Place molds into a TMCS vapor chamber </p> |
| - | 2a) Control layer mixture: 20g Base + 4g Curing agent | + | <p> 2a) Control layer mixture: 20g Base + 4g Curing agent</p> |
| - | 2b) Mix for 1 minute, degas for 2 minutes (standard protocol) | + | <p> 2b) Mix for 1 minute, degas for 2 minutes (standard protocol)</p> |
| - | 2c) Pour onto control layer mold and place mold in vacuum chamber for at least 20min | + | <p>2c) Pour onto control layer mold and place mold in vacuum chamber for at least 20min</p> |
| - | 3a) Flow layer mixture: 20g Base + 1g Curing agent | + | <p>3a) Flow layer mixture: 20g Base + 1g Curing agent</p> |
| - | 3b) Mix for 1 minute and degas for 2 minutes (standard protocol) | + | <p>3b) Mix for 1 minute and degas for 2 minutes (standard protocol)</p> |
| - | 3c) Spin coat onto flow layer at 2200-2400rpm for 35secs | + | <p>3c) Spin coat onto flow layer at 2200-2400rpm for 35secs</p> |
| - | 4 Remove control layer mold from vacuum chamber, making sure no bubbles are left on the surface (remove with a toothpick if you see some ) | + | <p>4 Remove control layer mold from vacuum chamber, making sure no bubbles are left on the surface (remove with a toothpick if you see some )</p> |
| - | 5 Place the control and flow layer in a 80C convection oven and incubate for 30 minutes (timing is critical here!) | + | <p>5 Place the control and flow layer in a 80C convection oven and incubate for 30 minutes (timing is critical here!)</p> |
| - | 6a) cut out control layer | + | <p>6a) cut out control layer </p> |
| - | 6b) punch holes | + | <p>6b) punch holes </p> |
| - | 6c) align to flow layer | + | <p>6c) align to flow layer</p> |
| - | 7 Put aligned device back into 80C oven and incubate for at least 90 minutes (and here you can increase the backing time) | + | <p>7 Put aligned device back into 80C oven and incubate for at least 90 minutes (and here you can increase the backing time)</p> |
| - | 8a) Remove devices from oven | + | <p>8a) Remove devices from oven</p> |
| - | 8b) cut them out | + | <p>8b) cut them out </p> |
| + | <p>8c) punch flow layer holes and cut the edges through the flow layer</p> | ||
Revision as of 03:54, 22 September 2011
PDMS two layer device fabrication
Back to protocols.made on 16.05.2011
Materials
- flow and control layer molds
- Sylgard 184 silicone elastomer kit: Base part and a Curing agent
- TMCS
Method
1 Place molds into a TMCS vapor chamber
2a) Control layer mixture: 20g Base + 4g Curing agent
2b) Mix for 1 minute, degas for 2 minutes (standard protocol)
2c) Pour onto control layer mold and place mold in vacuum chamber for at least 20min
3a) Flow layer mixture: 20g Base + 1g Curing agent
3b) Mix for 1 minute and degas for 2 minutes (standard protocol)
3c) Spin coat onto flow layer at 2200-2400rpm for 35secs
4 Remove control layer mold from vacuum chamber, making sure no bubbles are left on the surface (remove with a toothpick if you see some )
5 Place the control and flow layer in a 80C convection oven and incubate for 30 minutes (timing is critical here!)
6a) cut out control layer
6b) punch holes
6c) align to flow layer
7 Put aligned device back into 80C oven and incubate for at least 90 minutes (and here you can increase the backing time)
8a) Remove devices from oven
8b) cut them out
8c) punch flow layer holes and cut the edges through the flow layer
