Revision as of 03:56, 22 September 2011

PDMS two layer device fabrication

Back to protocols.

made on 16.05.2011

1 Place molds into a TMCS vapor chamber

2a) Control layer mixture: 20g Base + 4g Curing agent

2b) Mix for 1 minute, degas for 2 minutes (standard protocol)

2c) Pour onto control layer mold and place mold in vacuum chamber for at least 20min

3a) Flow layer mixture: 20g Base + 1g Curing agent

3b) Mix for 1 minute and degas for 2 minutes (standard protocol)

3c) Spin coat onto flow layer at 2200-2400rpm for 35secs

4 Remove control layer mold from vacuum chamber, making sure no bubbles are left on the surface (remove with a toothpick if you see some )

5 Place the control and flow layer in a 80C convection oven and incubate for 30 minutes (timing is critical here!)

6a) cut out control layer

6b) punch holes

6c) align to flow layer

7 Put aligned device back into 80C oven and incubate for at least 90 minutes (and here you can increase the backing time)

8a) Remove devices from oven

8b) cut them out

8c) punch flow layer holes and cut the edges through the flow layer

To clean the wafers:

@@ Line 28: / Line 28: @@
 <p>8c) punch flow layer holes and cut the edges through the flow layer</p>
-To clean the wafers:
-# Air-gun�
+To clean the wafers:
+# Air-gun
 # Isopropanol
 # PDMS