Team:EPF-Lausanne/Tools/Microfluidics/HowTo1

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<p> 1    Place molds into a TMCS vapor chamber</p>
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<p></p>
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<p> 2a)  Control layer mixture: 20g Base + 4g Curing agent </p>
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<p> 2b)  Mix for 1 minute, degas for 2 minutes (standard protocol)</p>
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<p> 2c)  Pour onto control layer mold and place mold in vacuum chamber for at least 20min</p>
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<p></p>
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<p> 3a)  Flow layer mixture: 20g Base + 1g Curing agent</p>
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<p> 3b)  Mix for 1 minute and degas for 2 minutes (standard protocol)</p>
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<p> 3c)  Spin coat onto flow layer at 2200-2400rpm for 35secs</p>
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<p></p>
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<p> 4    Remove control layer mold from vacuum chamber, making sure no bubbles are left on the surface (remove with a toothpick if you see some )</p>
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<p></p>
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<p> 5    Place the control and flow layer in a 80C convection oven and incubate for 30 minutes (timing is critical here!)</p>
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<p></p>
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<p> 6a)  Remover wafers both layers from the oven, cut out control layer </p>
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<p> 6b)  Punch holes </p>
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<p> 6c)  Align control to the flow layer</p>
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<p></p>
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<p> 7    Put aligned device back into 80C oven and incubate for at least 90 minutes (and here you can increase the backing time)</p>
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<p></p>
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<p> 8a)  Remove devices from oven</p>
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<p> 8b)  Cut them out </p>
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<p> 8c)  Punch flow layer holes and cut the edges through the flow layer</p>
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Revision as of 00:21, 21 September 2011

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