Team:EPF-Lausanne/Notebook/May2011

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* Developed in PGMEA. The three non-baked wafers are now stripped and blank again.
* Developed in PGMEA. The three non-baked wafers are now stripped and blank again.
* Valid wafer verified by optical microscopy and contact profilometry. Some dust contamination, '''will need to be blow-cleaned before PDMS moulding'''.
* Valid wafer verified by optical microscopy and contact profilometry. Some dust contamination, '''will need to be blow-cleaned before PDMS moulding'''.
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* The '''three other wafers can be cleaned and re-used''' (SRD, Pirana solution, 02 plasma strip).
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* The '''three other wafers can be cleaned and re-used''' (SRD, Piranha solution, 02 plasma strip).
For details of the process, see protocol for SU8 processes: [http://cmi.epfl.ch/photo/photo_process/files/Sawatec_processSU8.php| SU8 Process by CMI]
For details of the process, see protocol for SU8 processes: [http://cmi.epfl.ch/photo/photo_process/files/Sawatec_processSU8.php| SU8 Process by CMI]

Revision as of 16:42, 16 May 2011