Team:EPF-Lausanne/Protocols

From 2011.igem.org

(Difference between revisions)
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<p>• Place the control and flow layer in a 80C convection oven and incubate for 30 minutes (timing is critical here!)</p>
<p>• Place the control and flow layer in a 80C convection oven and incubate for 30 minutes (timing is critical here!)</p>
<p>• Remove casts from oven, cut out control layer, punch holes, and align to flow layer</p>
<p>• Remove casts from oven, cut out control layer, punch holes, and align to flow layer</p>
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<p>• Put aligned device back into 80C oven and incubate for at least 90 minutes (and here you can increase the backing)</p>
+
<p>• Put aligned device back into 80C oven and incubate for at least 90 minutes (and here you can increase the backing time)</p>
<p>• Remove devices from oven and punch flow layer holes</p>
<p>• Remove devices from oven and punch flow layer holes</p>

Revision as of 10:07, 16 May 2011

PDMS two layer device fabrication

made on 16.05.2011


Materials:


• flow and control layer molds

• Sylgard 184 silicone elastomer kit: Base part and a Curing agent

• TMCS


Method:


• Place molds into a TMCS vapor chamber

• Control layer mixture: 20g Base + 4g Curing agent

• Mix for 1 minute, degas for 2 minutes (standard protocol)

• pour onto control layer mold and place mold in vacuum chamber

• Flow layer mixture: 20g Base + 1g Curing agent

• Mix for 1 minute and degas for 2 minutes (standard protocol)

• Spin coat onto flow layer at 2200-2400rpm for 35secs (so far you can use my protocol on a spin coater)

• Remove control layer mold from vacuum chamber, making sure no bubbles are left on the surface (remove with a toothpick if you see some )

• Place the control and flow layer in a 80C convection oven and incubate for 30 minutes (timing is critical here!)

• Remove casts from oven, cut out control layer, punch holes, and align to flow layer

• Put aligned device back into 80C oven and incubate for at least 90 minutes (and here you can increase the backing time)

• Remove devices from oven and punch flow layer holes