Team:EPF-Lausanne/Tools/Microfluidics/HowTo1

From 2011.igem.org

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(PDMS chip fabrication)
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<p> 1    Place molds into a TMCS vapor chamber</p>
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<p> 1    Place molds into a TMCS vapor chamber for at least 20min</p>
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<p> 2a)  Control layer mixture: 20g Base + 4g Curing agent </p>
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<p> 2a)  Control layer mixture</p>
<p> 2b)  Mix for 1 minute, degas for 2 minutes (standard protocol)</p>
<p> 2b)  Mix for 1 minute, degas for 2 minutes (standard protocol)</p>
<p> 2c)  Pour onto control layer mold and place mold in vacuum chamber for at least 20min</p>
<p> 2c)  Pour onto control layer mold and place mold in vacuum chamber for at least 20min</p>
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<p> 3a)  Flow layer mixture: 20g Base + 1g Curing agent</p>
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<p> 3a)  Flow layer mixture </p>
<p> 3b)  Mix for 1 minute and degas for 2 minutes (standard protocol)</p>
<p> 3b)  Mix for 1 minute and degas for 2 minutes (standard protocol)</p>
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<p> 3c)  Spin coat onto flow layer at 2200-2400rpm for 35secs</p>
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<p> 3c)  Spin coat onto flow layer</p>
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<p> 4    Remove control layer mold from vacuum chamber, making sure no bubbles are left on the surface (remove with a toothpick if you see some )</p>
<p> 4    Remove control layer mold from vacuum chamber, making sure no bubbles are left on the surface (remove with a toothpick if you see some )</p>
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<p> 8c)  Punch flow layer holes and cut the edges through the flow layer</p>
<p> 8c)  Punch flow layer holes and cut the edges through the flow layer</p>
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Before use the chip should be aligned to the epoxy-treated glass slide. There can be DNA, bacteria or other substances spotted on it (in case of MITOMI device we spot different variants of the tetO sequence in this project). 
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Revision as of 10:17, 21 September 2011