Team:EPF-Lausanne/Tools/Microfluidics/HowTo1

From 2011.igem.org

(Difference between revisions)
(Making the chips)
Line 45: Line 45:
MITOMI chips are two layer devices. A thick upper layer is imprinted with the flow channels (those that will contain reagents) and a thin bottom layer is imprinted with the control channels (used to actuate on-chip valves). The role of each layer is explained further in [[Team:EPF-Lausanne/Tools/Microfluidics/HowTo2|Part II]].
MITOMI chips are two layer devices. A thick upper layer is imprinted with the flow channels (those that will contain reagents) and a thin bottom layer is imprinted with the control channels (used to actuate on-chip valves). The role of each layer is explained further in [[Team:EPF-Lausanne/Tools/Microfluidics/HowTo2|Part II]].
-
Casting PDMS involves mixing a precursor and a curing agent (sold as a kit from XXX), degassing, pouring into the mould (or spin-coating onto the wafer for the thin layers), and partial curing at 80°C. After curing, holes are punched through the flow layer, to allow plugging in of external tubing (again, see part II). The two layers are then superposed and aligned by hand, so that the valves from the control layer overlap the correct channels on the flow layer.
+
Casting PDMS involves mixing a precursor and a curing agent (sold as the Sylgard 184 kit by Dow Corning), degassing, pouring into the mould (or spin-coating onto the wafer for the thin layers), and partial curing at 80°C. After curing, holes are punched through the flow layer, to allow plugging in of external tubing (again, see part II). The two layers are then superposed and aligned by hand, so that the valves from the control layer overlap the correct channels on the flow layer.
After alignment, curing is finalised. This fully solidifies the chip and ensures a strong bond between the two layers. After curing, holes are punched through to the flow layer. For most chips, the last step is to bond them them to a glass microscope slide, following a plasma surface treatment if strong bonding is required. In the case of the MITOMI chips, they are instead aligned onto a spotted array from a DNA library. At this point, the chip is ready to use.
After alignment, curing is finalised. This fully solidifies the chip and ensures a strong bond between the two layers. After curing, holes are punched through to the flow layer. For most chips, the last step is to bond them them to a glass microscope slide, following a plasma surface treatment if strong bonding is required. In the case of the MITOMI chips, they are instead aligned onto a spotted array from a DNA library. At this point, the chip is ready to use.

Revision as of 01:02, 22 September 2011